Description
This product utilizes the 5th generation of design rules of ST’s proprietary STripFET™ technology. The lowest available RDS(on)*Qg, in this chip scale package, makes this device suitable for the most demanding DC-DC converter applications, where high power density is to be achieved.

Features
■ Ultra low top and bottom junction to case thermal resistance
■ RDS(on) * Qg industry benchmark
■ Extremely low on-resistance RDS(on)
■ Very low switching gate charge
■ Fully encapsulated die
■ 100% matte tin finish (in compliance with the 2002/95/EC european directive)
■ High avalanche ruggedness
■ PolarPAK® is a trademark of VISHAY

Application
■ Switching applications