maxiFLOW™ design features a low profile, spread fin
array that maximizes surface area for more effective
convection (air) cooling
maxiGRIP™ attachment applies steady, even pressure to
the component and does not require holes in the PCB
Meets Telcordia GR-63-Core Office Vibration; ETSI 300
019 Transportation Vibration; and MIL-STD-810 Shock and
Unpackaged Drop Testing standards
Comes preassembled with high performance, phase
changing, thermal interface material
Designed for low profile components from 1.5 to 2.99mm