メーカー | 部品番号 | データシート | 部品情報 |
Analog Devices |
SSM2375CBZ
|
39Kb / 1P |
Dimensions shown in millimeters
|
Micrel Semiconductor |
MIC5388
|
582Kb / 12P |
Dual 200mA Peak LDO in Wafer Level Chip Scale Package
|
Xilinx, Inc |
CS280
|
47Kb / 1P |
Ball Chip Scale Package
|
Analog Devices |
RM-8
|
127Kb / 1P |
8-Lead Mini Small Outline Package [MSOP] Dimensions shown in millimeters
|
Nexperia B.V. All right... |
GAN3R2-100CBE
|
299Kb / 13P |
100 V, 3.2 mOhm Gallium Nitride (GaN) FET in a 3.5 mm x 2.13 mm Wafer Level Chip-Scale Package (WLCSP)
27 April 2023 |
List of Unclassifed Man... |
TO247
|
39Kb / 2P |
HEXFET TO-247AC Outline Dimensions are shown in millimeters (inches)
|
Analog Devices |
ML-24-5
|
163Kb / 1P |
24-Lead Module with Connector Interface. Dimensions shown in millimeters.
|
BC-148
|
276Kb / 1P |
148-Lead Chip Scale Package Ball Grid Array
|
AVAGO TECHNOLOGIES LIMI... |
VMMK-2103
|
222Kb / 2P |
E-pHEMT Amplifier in a Wafer Scale Package (0.5 - 6GHz)
|
Texas Instruments |
TLV5610IYZ
|
511Kb / 16P |
[Old version datasheet] DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package?봒b-Free/Green
|