PRODUCT DESCRIPTION

AWC6325 addresses the demand for increased integration in dual-band handsets for CDMA networks. The small footprint 3 mm x 5 mm x 0.9 mm surface mount RoHS compliant package contains independent RF PA paths to ensure optimal performance in both frequency bands in less board area than two single band PAs.

FEATURES

• InGaP HBT Technology

• High Efficiency:

• 37 % @ POUT = +28 dBm

• 20 % @ POUT = +16 dBm

• 10 % @ POUT = +10 dBm

• Low Quiescent Current: 4 mA

• Internal Voltage Regulation

• Built-in Directional Coupler

• Common VMODE Control Line

• Suitable for SMPS and average power tracking systems with variable supply voltages

• APT can reduce TS.09 average power consumption more than 25%

• Reduced External Component Count

• Thin Package: 0.9 mm

• RoHS Compliant Package, 260 oC MSL-3

APPLICATIONS

• Dual-band Wireless Handsets and Data Devices

for CDMA/EVDO networks:

• Cellular BC 0 and 10

• PCS BC 1 and 14