メーカー | 部品番号 | データシート | 部品情報 |
Maxim Integrated Produc... |
21-0111
|
31Kb / 1P |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD
Rev E |
21-0036
|
42Kb / 1P |
PACKAGE OUTLINE, 8L UMAX/USOP
Rev L |
21-0042
|
46Kb / 1P |
PACKAGE OUTLINE, SOIC,300
Rev F |
SMSC Corporation |
8SOIC
|
295Kb / 1P |
8 PIN SOIC PACKAGE OUTLINE
|
Maxim Integrated Produc... |
21-0137
|
48Kb / 2P |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
Rev J |
Dallas Semiconductor |
56-G6005-001
|
46Kb / 1P |
MARKETING OUTLINE - 16L CHIP SCALE BGA
|
ACCUTEK MICROCIRCUIT CO... |
AK08D300-NSO
|
741Kb / 11P |
Small Outline Package SOIC, SOJ and PLCC DIP Adapters
|
Integrated Circuit Syst... |
MK2761A
|
142Kb / 6P |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
Fairchild Semiconductor |
SOIC4_DIM
|
21Kb / 1P |
SOIC-4 Package Dimensions
|
Integrated Device Techn... |
ICS570
|
256Kb / 11P |
8-pin SOIC package
|