Description In Microsemis Powermite® surface mount package, these zener diodes provide power-handling capabilities found in larger packages. In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment. Features • Surface Mount Packaging • Integral Heat Sink Locking Tabs • Compatible with automatic insertion equipment • Full metallic bottom eliminates flux entrapment • Zener voltage 1.8 to 100V • Low noise • Low reverse leakage current • Tight tolerance available
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