TSON8-FL データシート(PDF) - Amkor Technology

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TSON8-FL データシート (PDF) - Amkor Technology

TSON8-FL Datasheet PDF - Amkor Technology


部品番号	TSON8-FL

ダウンロード	TSON8-FL ダウンロード

ファイルサイズ	740.38 Kbytes

ページ	2 Pages

メーカー	AMKOR [Amkor Technology]

ホームページ	http://www.amkor.com

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部品情報	Bare copper leadframe with no plating

TSON8-FL Datasheet (PDF)

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ダウンロードデータシート

TSON8-FL Datasheet PDF - Amkor Technology


部品番号	TSON8-FL

ダウンロード	TSON8-FL Click to download

ファイルサイズ	740.38 Kbytes

ページ	2 Pages

メーカー	AMKOR [Amkor Technology]

ホームページ	http://www.amkor.com

Logo

部品情報	Bare copper leadframe with no plating

TSON8-FL データシート (HTML) - Amkor Technology

TSON8-FL Datasheet HTML 1Page - Amkor Technology

TSON8-FL Datasheet HTML 2Page - Amkor Technology

同様の部品番号 - TSON8-FL

メーカー	部品番号	データシート	部品情報
Amkor Technology	TSON8-FL-V01	928Kb / 2P	TSON8-FL (Flat Lead) is a smaller package (3.3 x 3.3 mm) with thermal enhancments that give a 64% reduction in footprint area compared with standard SOIC 8 ld package 02/21

同様の説明 - TSON8-FL

メーカー	部品番号	データシート	部品情報
Lite-On Technology Corp...	CN-111010	34Kb / 2P	Tin Lead Plating Phase Out for Leadframe Products
Amkor Technology	SOD123-FL	446Kb / 2P	Bare copper leadframe with no plating
Amkor Technology	SOD128-FL	445Kb / 2P	Bare copper leadframe with no plating
List of Unclassifed Man...	1344803	109Kb / 4P	24 AWG Solid Bare Copper Conductors, Polyolefin Insulation
	1345253	101Kb / 3P	23 AWG Solid .023 bare copper or bare copper-covered steel conductor, polyethylene insulation
	1345263	106Kb / 4P	24 AWG Solid Bare Copper Conductors, Polyolefin Insulation
	1347027	102Kb / 3P	Series 6, 18 AWG solid .040 bare copper or bare copper-covered steel conductor
Bourns Electronic Solut...	CSM2F-7036	614Kb / 4P	Shunt Resistor with Sense Pins & Bare Copper Terminals 10/22
	CSM2F-8518	620Kb / 4P	Shunt Resistor with Sense Pins & Bare Copper Terminals 10/22
	CSM2F-8536	621Kb / 4P	Shunt Resistor with Sense Pins & Bare Copper Terminals 10/22

Amkor Technology について

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*この情報はあくまでも一般的な情報であり、上記の情報によって生じたいかなる損失や損害についても責任を負うものではありません。

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