Features
■ Supports 60 MHz clock rate
■ Supports DDR mode for SD Card™
■ Compliant with – SD Specification Part 1 Physical Layer Specification 3.00 (SDR12, SDR25, DDR50) – SD Specification Part 1 Physical Layer Specification 2.00
■ Bi-directional with direction control pin
■ Balanced propagation delays: tPLH ≈ tPHL
■ LDO power-down support. When the LDO is powered down, VCCB is pulled to GND via the 130 Ω resistor. When VCCB = 0 V, there is no additional leakage seen on VCCA.
■ EMI filtering and signal conditioning
■ Supports both 1.8 V and 2.9 V data translation on card side
■ Integrated LDO to supply 1.8 V or 2.9 V power for B-side I/Os (pin-selectable); can be used also externally
■ Integrated pull-up and pull-down resistors on B-side
■ Operating voltage range – VCCA = 1.62 V to 1.98 V – VBAT = 3.0 V to 5.0 V
■ Latch-up performance exceeds 100 mA (JEDEC Standard 78)
■ ESD protection for card side (B-port, CD and WP pins) – ±8 kV contact discharge (IEC61000-4-2) – ±15 kV air-gap discharge (IEC61000-4-2)
■ ESD protection for host side (A-side) – ±2 kV HBM (JEDEC 22-A114) – ±200 V MM (JEDEC 22-A115)
■ Operating temperature range –40 °C to +85 °C
■ Space-saving Flip Chip 25 package (2 x 2 x 0.605 mm, 0.4 mm bump pitch)
■ RoHS compliant, lead-free soldering capable

Applications
■ Mobile phones, smartphones
■ PDAs
■ Cameras
■ SD Card readers
■ Any device with SD memory card