MCP1630 AUTOMOTIVE INPUT BOOST

CONVERTER DEMO BOARD USER’S GUIDE

© 2007 Microchip Technology Inc.

DS51608B-page iii

Table of Contents

Preface ........................................................................................................................... 1

Introduction............................................................................................................ 1

Document Layout .................................................................................................. 1

Conventions Used in this Guide ............................................................................ 2

Recommended Reading........................................................................................ 2

The Microchip Web Site ........................................................................................ 3

Customer Support ................................................................................................. 3

Document Revision History ................................................................................... 3

Chapter 1. Product Overview

1.1 Introduction...................................................................................................... 5

1.2 What is the MCP1630 Automotive Input Boost Converter Demo Board? ....... 6

1.3 What the MCP1630 Automotive Input Boost Converter Demo Board Kit

Includes ..................................................................................................... 6

Chapter 2. Installation and Operation

2.1 Introduction...................................................................................................... 7

2.2 Features .......................................................................................................... 7

2.3 Getting Started ................................................................................................ 8

Appendix A. Schematic and Layouts

A.1 Introduction ................................................................................................... 11

A.2 Board – Schematic........................................................................................ 12

A.3 Board – Top Silk Layer ................................................................................. 13

A.4 Board – Top Metal Layer .............................................................................. 14

A.5 Board – Bottom Metal Layer ......................................................................... 15

Appendix B. Bill Of Materials (BOM)

Appendix C. Demo Board Firmware

C.1 Device Firmware........................................................................................... 19

Worldwide Sales and Service .................................................................................... 20