L9679P datasheet(270/272 Pages) STMICROELECTRONICS

部品番号	L9679P

部品情報	Automotive advanced airbag IC for mid/high end applications

PDF	272 Pages

Scroll/Zoom	100%

メーカー	STMICROELECTRONICS [STMicroelectronics]

ホームページ	http://www.st.com

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270 / 272 page

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L9679P

270/272

DocID029275 Rev 1

Table 74. TQFP100 (14x14x1.4 mm exp. pad down) package mechanical data

Ref

Dimensions

Millimeters

Inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min.

Typ.

Max.

Min.

Typ.

Max.

1.20

0.0472

0.05

0.15

0.0020

0.0059

0.95

1.00

1.05

0.0374

0.0394

0.0413

0.17

0.22

0.27

0.0067

0.0087

0.0106

0.09

0.20

0.0035

0.0079

15.80

16.00

16.20

0.6220

0.6299

0.6378

13.80

14.00

14.20

0.5433

0.5512

0.5591

D2(2)

2. The size of exposed pad is variable depending of lead frame design pad size. End user should verify “D2”

and “E2” dimensions for each device application.

5.40

8.50

0.2126

0.3346

12.00

0.4724

15.80

16.00

16.20

0.622

0.6299

0.6378

13.80

14.00

14.20

0.5433

0.5512

0.5591

E2(2))

5.40

8.50

0.2126

0.3346

12.00

0.4724

0.50

0.0197

0.45

0.60

0.75

0.0177

0.0236

0.0295

1.00

0.0394

3.50

7.00

0.1378

0.2756

ccc

0.08

0.0031

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