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XP-G データシート(PDF) 10 Page - Cree, Inc |
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XP-G データシート(HTML) 10 Page - Cree, Inc |
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10 / 28 page ![]() Copyright © 2009-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 10 XLamp® Xp-G LED tyPiCAL sPAtiAL Distribution thErMAL DEsiGn The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 0 20 40 60 80 100 -90 -70 -50 -30 -10 10 30 50 70 90 Angle (º) Cool White Thermal Design 0 200 400 600 800 1000 1200 1400 1600 0 20 40 60 80 100 120 140 160 Ambient Temperature (ºC) Rj-a = 10°C/W Rj-a = 15°C/W Rj-a = 20°C/W Rj-a = 25°C/W |
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