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MP4569 データシート(PDF) 13 Page - Monolithic Power Systems |
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MP4569 データシート(HTML) 13 Page - Monolithic Power Systems |
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13 / 17 page ![]() MP4569―75V, 0.3A, SYNCHRONOUS STEP-DOWN CONVERTER MP4569 Rev. 1.0 www.MonolithicPower.com 13 9/12/2014 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2014 MPS. All Rights Reserved. The UVLO threshold can be computed from below two equations. TH_Rising ) EN 3M//R2 R1 (1 UVLO TH_Rising × + = TH_Falling ) EN 3M//R2 R1 (1 UVLO TH_Falling × + = Soft Start Capacitor The soft start time is the duration when SS is charged from 0 to FB reference voltage 1V by an internal 5μA current source. So the capacitor at SS pin can be chosen according to below formula: F) μ ( t C SS SS × = 5 Feed-Forward Capacitor As described above that the PWM control scheme of MP4569 is very special and the HS_FET turns on when FB drops lower than reference voltage. This brings good load transient performance. However, this also makes the HS_FET turn on moment is very sensitive to the FB voltage. Once there is noise on FB, the moment HS_FET turns on is easy to be affected, and then Fsw jitter would occur. The Fsw jitter is easy to happen especially when Vo ripple is very small. To improve the jitter performance, a small feedforward capacitor between Vo and FB can be used and typical 39pF is recommended. PCB Layout PCB layout is very important to achieve stable operation. Please follow below guidelines and use Figure 5 as reference. 1) Keep the path of switching current short and minimize the loop area formed by input capacitor, high-side, low-side MOSFET and output capacitor. 2) Bypass ceramic capacitors should be as close as possible to the VIN pin. 3) Make sure that all feedback connections are short and direct. Place the feedback resistors as close to the chip as possible. 4) Keep SW away from sensitive analog areas such as FB. 5) For better thermal performance and long-term reliability consideration, VIN, SW and GND should be connected to a large copper area respectively to cool the chip. Top Layer Bottom Layer (a) Layout Reference of QFN-10 Package(7) |
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