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MPM3686 データシート(PDF) 4 Page - Monolithic Power Systems

部品番号 MPM3686
部品情報  18V 20A Step-Down Power Module in 12x15x4mm QFN
PDF  19 Pages
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メーカー  MPS [Monolithic Power Systems]
ホームページ  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MPM3686 データシート(HTML) 4 Page - Monolithic Power Systems

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MPM3686 – 18V 20A STEP-DOWN POWER MODULE
MPM3686 Rev. 1.02
www.MonolithicPower.com
4
10/13/2016
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2016 MPS. All Rights Reserved.
ABSOLUTE MAXIMUM RATINGS (1)
Supply Voltage VIN to GND .............-0.3V to 21V
VSW(DC) to GND .......................... –1V to VIN+0.3V
VSW5 (30ns) to GND............. –3 V to VIN+3V or 24V
VBST .......................................... –0.3 V to VIN+6V
All Other Pins to AGND..................–0.3V to +6V
Continuous Output Current......................... 22A
Junction Temperature...............................150
C
Lead Temperature ....................................260
C
Storage Temperature.............. –55
C to +150C
MSL ................................................... Level 3(5)
ESD (HBM) ................................................. 2kV
ESD (CDM)............................................... 500V
Recommended Operating Conditions
(3)
Supply Voltage VIN........................... 4.5V to 18V
Output Voltage VOUT ........................ 0.65V to 5V
Enable Current IEN……………………..…....1mA
Ambient Temperature................–40
C to +85C
Junction Temperature..............–40
C to +125C
Thermal Resistance
(4) θ
JB
θJA
12x15x4 QFN ....……………2.5……14.0
C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
5) Need to get some test data from 1
st sample for calibration and
evaluation for MSL Level 2.



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