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MP4050 データシート(PDF) 2 Page - Monolithic Power Systems |
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MP4050 データシート(HTML) 2 Page - Monolithic Power Systems |
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2 / 21 page ![]() MP4050 – NON-ISOLATED, HIGH BRIGHTNESS, LED DRIVER MP4050 Rev.1.02 www.MonolithicPower.com 2 1/18/2016 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2016 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking MP4050GJ* TSOT23-5 AGN MP4050GS** SOIC8 MP4050 * For Tape & Reel, add suffix –Z (e.g. MP4050GJ–Z); ** For Tape & Reel, add suffix –Z (e.g. MP4050GS–Z); PACKAGE REFERENCE TOP VIEW VCC PRO GND 1 2 3 5 4 DRAIN SOURCE VCC PRO GND SOURCE N.C DRAIN N.C N.C 1 2 3 4 8 7 6 5 TOP VIEW TSOT23-5 SOIC8 ABSOLUTE MAXIMUM RATINGS (1) Drain to SOURCE .........................-0.3V to 500V VCC, SOURCE to GND… ……..-0.3V to 6.5V PRO to GND ..................................-0.7V to 6.5V Source Current on PRO ............................. 4mA Continuous Power Dissipation (TA = +25°C) (2) --TSOT23-5, TA=25C................................... 1W --SOIC8, TA=25C......................................... 1W Junction Temperature...............................150 C Lead Temperature ....................................260 C Storage Temperature............... -60 C to +150C ESD Capability Human Body Mode .......... 2.0kV ESD Capability Machine Mode .................. 200V Recommended Operating Conditions (3) Operating Junction Temp. (TJ)..-40°C to +125°C Operating VCC range .....................4.5V to 4.7V Thermal Resistance (4) θJA θJC TSOT23-5.............................. 100 ..... 55... C/W SOIC8..................................... 96 ...... 45... C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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