EL2250CSZ datasheet(9/15 Pages) RENESAS

9 / 15 page

EL2250, EL2450

FN7061 Rev 3.00

Page 9 of 15

May 19, 2006

Typical Performance Curves (Continued)

Supply Current vs Supply Voltage

(per amplifier)

Supply Current vs Die

Temperature (per amplifier)

Input Resistance vs Die

Temperature

Offset Voltage vs Die Temperature

(4 Samples)

Input Bias Current vs Input Voltage

Input Offset Current and Input Bias

Current vs Die Temperature

Positive Output Voltage Swing vs

Die Temperature, RL = 150 to

GND

Negative Output Voltage Swing vs

Die Temperature, RL = 150 to

GND

Channel to Channel Isolation vs

Frequency

Package Power Dissipation vs Ambient Temp.

SEMI G42-88 Single Layer Test Board

Ambient Temperature (°C)

1.8

1.6

1.4

1.2

0.8

0.6

0.4

0.2

025

100

125

150

1.54W

1.25W

IP1



JA =

81°

C/W

IP8



JA =1

00°C

Package Power Dissipation vs Ambient Temp.

JEDEC JESD51-3 Low Effective Thermal Conductivity

Test Board

Ambient Temperature (°C)

1.2

0.8

0.6

0.4

0.2

100

125

150

1.042W

781W



JA =

120

°C

8 

JA =1

60°C

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