Data Sheet

ADL5335

Rev. 0 | Page 7 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

5.5 V

SCLK, SDIO, CS, FA

3.9 V

Enable Voltage, ENBL

2.2 V

Input Average RF Power

12 dBm

2.5 V p-p

Internal Power Dissipation

725 mW

Maximum Junction Temperature

150°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

1

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THREMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 4 shows the thermal resistance from the die to ambient

Table 4. Thermal Resistance

Package Type

Unit

CP-16-39

58.7

2.2

°C/W

ESD CAUTION