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REF3425 データシート(PDF) 13 Page - Texas Instruments

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部品番号 REF3425
部品情報  Low-Drift, Low-Power, Small-Footprint Series Voltage References
PDF  28 Pages
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI1 - Texas Instruments

REF3425 データシート(HTML) 13 Page - Texas Instruments

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J
A
D
JA
T
T
P
R
T
u
Thermal Hysteresis - Cycle 1 (ppm)
0
5%
10%
15%
20%
25%
30%
D016
13
REF3425-Q1, REF3430-Q1, REF3433-Q1, REF3440-Q1, REF3450-Q1
www.ti.com
SBAS901 – JULY 2018
Product Folder Links: REF3425-Q1 REF3430-Q1 REF3433-Q1 REF3440-Q1 REF3450-Q1
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Thermal Hysteresis (continued)
Typical thermal hysteresis distribution is as shown in Figure 26.
Figure 26. Thermal Hysteresis Distribution (VREF)
8.4 Power Dissipation
The REF34xx-Q1 voltage references are capable of source and sink up to 10 mA of load current across the rated
input voltage range. However, when used in applications subject to high ambient temperatures, the input voltage
and load current must be carefully monitored to ensure that the device does not exceeded its maximum power
dissipation rating. The maximum power dissipation of the device can be calculated with Equation 2:
where
PD is the device power dissipation
TJ is the device junction temperature
TA is the ambient temperature
RθJA is the package (junction-to-air) thermal resistance
(2)
Because of this relationship, acceptable load current in high temperature conditions may be less than the
maximum current-sourcing capability of the device. In no case should the device be operated outside of its
maximum power rating because doing so can result in premature failure or permanent damage to the device.



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