21

623345f

LT6233/LT6233-10/

LT6234/LT6235

DD Package

8-Lead Plastic DFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1698)

3.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. ALL DIMENSIONS ARE IN MILLIMETERS

3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

4. EXPOSED PAD SHALL BE SOLDER PLATED

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

2.38

±0.10

(2 SIDES)

1

4

8

5

PIN 1

TOP MARK

0.200 REF

0.00 – 0.05

(DD8) DFN 0203

0.28

± 0.05

2.38

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.15

±0.05

0.50

BSC

0.675

±0.05

3.5

±0.05

PACKAGE

OUTLINE

0.28

± 0.05

0.50 BSC

PACKAGE DESCRIPTIO