DATASHEET

Lamp

EALP05RDJYA3

7

Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 26.Nov.2012. Issue No: 1 Rev:1

www.everlightamericas.com

Notes

1.

Lead Forming

During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.

Lead forming should be done before soldering.

Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it

may break the LEDs.

Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.

When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the

LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.

2.

Storage

The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight Americas and the

storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed

container with a nitrogen atmosphere and moisture absorbent material.

Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can

occur.

3.

Soldering

Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,

and soldering beyond the base of the tie bar is recommended.

Recommended soldering conditions:

Hand Soldering

DIP Soldering

Temp. at tip of iron

300

℃ Max. (30W

Max.)

Preheat temp.

100

℃

Max.

(60

sec

Max.)

Soldering time

3 sec Max.

Bath temp. & time

260 Max., 5 sec Max

Distance

3mm Min.(From solder

joint to epoxy bulb)

Distance

3mm Min. (From solder

joint to epoxy bulb)