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STN8811 データシート(PDF) 4 Page - STMicroelectronics

部品番号 STN8811
部品情報  Trio of Nomadik application processors bring multimedia to next-generation mobile devices
PDF  5 Pages
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STN8811 データシート(HTML) 4 Page - STMicroelectronics

  STN8811 Datasheet HTML 1Page - STMicroelectronics STN8811 Datasheet HTML 2Page - STMicroelectronics STN8811 Datasheet HTML 3Page - STMicroelectronics STN8811 Datasheet HTML 4Page - STMicroelectronics STN8811 Datasheet HTML 5Page - STMicroelectronics  
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STn8810/STn8811/STn8812
4/5
Open platform strategy
The STn8810 is based around the MIPI™ software and hardware interface standard. This open platform
strategy provides manufacturers with roadmap flexibility, allowing them to avoid becoming locked into a
proprietary CPU architecture or vendor technology. This approach is facilitated by the following design
points.
The STn8810 employs the third-party ARM® processor which is the standard CPU for mobile
devices, with industry-wide application support.
Open, standard APIs are provided for the development of application code on a level which is
abstracted from the physical hardware. This allows the development of multimedia plug-ins that are
portable between products and which can be reused on future products without modification.
The STn8810 offers a rich set of peripherals and the capability of adding new smart accelerators
when required.
The STn8810 enables best-in-class algorithm development on its smart accelerators.
Stacked memory options
The STn8811 and STn8812 build on the STn8810 by stacking their respective amounts of both SDRAM and
Flash memories in pin-compatible packages, a technology that STMicroelectronics has mastered for
commercial use. In addition to saving space - the footprint of the stacked chips is the same as that for the
STn8810, a critical factor for today’s compact clamshell designs - these stacked versions give manufacturers
unprecedented flexibility on the production line.
The stacked versions promise lower product costs, added system security, faster data throughput, and future
performance enhancements.
Revision History
Table 1: Revision History
Date
Revision
Description of Changes
February 2005
1
First Issue.



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