Data Sheet

ADV7613

Rev. B | Page 13 of 13

OUTLINE DIMENSIONS

Figure 7. 100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-100-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADV7613BBCZ

−40°C to +85°C

100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-100-4

ADV7613BBCZ-RL

−40°C to +85°C

100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-100-4

ADV7613WBBCZ

−40°C to +85°C

100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-100-4

ADV7613WBBCZ-RL

−40°C to +85°C

100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-100-4

ADV7613WBBCZ-P

−40°C to +85°C

100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-100-4

ADV7613WBBCZ-P-RL

−40°C to +85°C

100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-100-4

AUTOMOTIVE PRODUCTS

The ADV7613W models are available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in

automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these models.

9.10

9.00 SQ

8.90

7.20

BSC SQ

0.50

0.45

0.40

*COMPLIANT TO JEDEC STANDARDS MO-275-DDAB-1

WITH THE EXCEPTION OF THE PACKAGE HEIGHT

COPLANARITY

0.12

0.26

REF

A

B

C

D

E

F

G

H

J

K

7

6

3

2

1

5

4

BALL DIAMETER

0.80

BSC

0.90

REF

DETAIL A

A1 BALL

CORNER

A1 BALL

CORNER

DETAIL A

BOTTOM VIEW

TOP VIEW

SEATING

PLANE

*1.400

1.253

1.173

0.975

0.910

0.845

0.383

0.343

0.303

8

9

10

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registered trademarks are the property of their respective owners.

D13676-0-5/17(B)