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FSUSB30 データシート(PDF) 16 Page - ON Semiconductor |
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FSUSB30 データシート(HTML) 16 Page - ON Semiconductor |
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16 / 19 page ![]() © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB30 Rev. 1.1.8 15 Physical Dimensions Figure 18. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner with- out notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. |
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