PEDL66517-03

1Semiconductor

ML66517 Family

26/28

QFP64-P-1414-0.80-BK

Package material

Lead frame material

Pin treatment

Solder plate thickness

Package weight (g)

Epoxy resin

42 alloy

Solder plating

5 m or more

0.87 TYP.

(Unit : mm)

MIRROR FINISH

Notes for Mounting the Surface Mount Type Packages

The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product

name, package name, pin number, package code and desired mounting conditions (reflow method,

temperature and times).