US5501ASAC datasheet(3/10 Pages) UPI

3 / 10 page

uS5501

uS5501-DS-F0003, Apr. 2012

www.upi-semi.com

Package Thermal Resistance (Note 3)

WDFN2x2-8L θ

JA -------------------------------------------------------------------------------------------------------------------- 155

C/W

WDFN2x2-8L θ

JC --------------------------------------------------------------------------------------------------------------------- 20

C/W

SOT23-8L θ

JA -------------------------------------------------------------------------------------------------------------------- 250

C/W

SOT23-8L θ

JC --------------------------------------------------------------------------------------------------------------------- 140

C/W

SOP-14L θ

JA -------------------------------------------------------------------------------------------------------------------- 120

C/W

SOP-14L θ

JC --------------------------------------------------------------------------------------------------------------------- 32

C/W

Power Dissipation, P

D @ TA = 25

WDFN2x2-8L --------------------------------------------------------------------------------------------------------------------------------- 0.65W

SOT23-8L -------------------------------------------------------------------------------------------------------------------- 0.4W

SOP-14L -------------------------------------------------------------------------------------------------------------------- 0.83W

(Note 4)

Operating Junction Temperature Range -------------------------------------------------------------------------------------- -40°C to +125°C

Operating Ambient Temperature Range -------------------------------------------------------------------------------------- -40°C to +85°C

Power Input Voltage, V

IN ----------------------------------------------------------------------------------------------------------- +2.7 to +13.2V

Absolute Maximum Rating

Thermal Information

Recommended Operation Conditions

(Note 1)

Supply Input Voltage, VCC -------------------------------------------------------------------------------------------- -0.3V to +15V

Other Pins to GND -------------------------------------------------------------------------------------------------------------- -0.3V to (VCC + 0.3V)

Storage Temperature Range ------------------------------------------------------------------------------------------------------------- -65OC to +150OC

Junction Temperature ------------------------------------------------------------------------------------------------------------------------------------ 150OC

Lead Temperature (Soldering, 10 sec) ------------------------------------------------------------------------------------------------------------ 260OC

ESD Rating (Note 2)

HBM (Human Body Mode) --------------------------------------------------------------------------------------------------------------------- 2kV

MM (Machine Mode) ----------------------------------------------------------------------------------------------------------------------------- 200V

Note 1. Stresses listed as the above “ Absolute Maximum Ratings” may cause permanent damage to the device.

These are for stress ratings. Functional operation of the device at these or any other conditions beyond those

indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may remain possibility to affect device reliability.

Note 2. Devices are ESD sensitive. Handling precaution recommended.

Note 3. θ

JA is measured in the natural convection at TA = 25

C on a low effective thermal conductivity test board of

JEDEC 51-3 thermal measurement standard.

Note 4. The device is not guaranteed to function outside its operating conditions.

US5501ASAC データシート(PDF) 3 Page - uPI Group Inc.

US5501ASAC データシート(HTML) 3 Page - uPI Group Inc.

Html Pages

1 2 3 4 5 6 7 8 9 10

データシートダウンロード