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STV0974E データシート(PDF) 15 Page - STMicroelectronics

部品番号 STV0974E
部品情報  Mobile Imaging DSP
PDF  69 Pages
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STV0974E データシート(HTML) 15 Page - STMicroelectronics

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Functional description
STV0974
15/61
The MCU sequence order is top left to top right and top to bottom.
Figure 6 shows the MCU structure made of 4 blocks: 2 blocks of 8x8 Y component, 1 block of 8x8 U
component and one block of 8x8 V component. The series of blocks must be processed according
to this order.
Each block is composed of 8x8 components.
Figure 7 presents the structure of BlockY1, as an
example.
The data sequence inside each block is left to right and top to bottom.
To summarize, at the output of Raster to Block converter, the data order is the following:
Y data of blockY1 of first MCU (64 data from left to right, then top to bottom)
Y data of blockY2 of first MCU (64 data from left to right, then top to bottom)
U data of blockU of first MCU (64 data from left to right, then top to bottom)
V data of blockV of first MCU (64 data from left to right, then top to bottom)
Y data of blockY1 of second MCU (64 data from left to right, then top to bottom)
Y data of blockY2 of second MCU (64 data from left to right, then top to bottom)
U data of blockU of second MCU (64 data from left to right, then top to bottom)
V data of blockV of second MCU (64 data from left to right, then top to bottom)
... up to last image MCU.
Figure 6: Structure of each MCU
Figure 7: Structure of block Y1
YY
U
V
MCU
BlockY1
BlockY2
BlockU
BlockV
Y
Y
Y
Y
Y
Y
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Y
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8
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BlockY1



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