DFG8340

Fully Automatic In-Feed Surface Grinder

Supports small volume grinding with high precision

DFG8340

Realizes stable high-precision wafer processing

With the integration of devices, wafer manufacturing processing, which requires high-

planarity, is adopting surface grinding.

DFG8340, the successor of DFG830 (equipment used all across the world), is equipped with

a high-rigidity spindle, realizing stable and high planarization of wafers by minimizing the

impact of the processing heat.

Available for various workpieces less than 8-inches in size

DFG8340 is a simple and compact fully automatic grinder which adopts a single spindle,

dual chuck table, and single turn table structure. It can process silicon wafers less than 8-

inches with low-damage low-amount processing, and SiC, sapphire, and ceramics.

A grinder that replaces lapping

General lapping is a batch process that uses loose

grain, making it difficult to control the finish thickness.

DFG8340 improves processing quality and the

environmental load by measuring wafer thickness in

real time and processing with only DI water.