Ultrahigh-precision planarization

technology using a diamond bit

The DISCO surface planer provides solutions for high-precision

planarization of ductile materials such as metals, resins, and their

composites as well as solutions for reducing bump height variation

and surface roughness.

Processability by workpiece material

DFS8910/8960 & DAS8920/8930

Advanced planarization

Surface Planer

Bump height

variation

1.7 µm

0.5 µm

Bump surface

roughness (Rz)

1.373 µm

0.039 µm

Metal

Resin

Others

Good

processability

Au

Cu

Other

Photoresist

(positive & negative)

Polymide

Composites of

materials stated

on the left

Difficult

processability

Ni(electrolysis)

Ｆ

e

Reinforced resin

Si

Glass

Ceramics

[Processing example 1] Bump planarization

The planarization process reduces Au bump height variation and

stress (temperature and load) when bonding Au-Au interfaces for use

in next generation SiP solutions.

Note: Actual processability varies depending on the workpiece. Please contact

your DISCO sales representative for details.

Support for a variety of workpiece types

Three models for a variety of applications

Optional support is also available for irregularly shaped workpieces,

including substrates, die, or square workpieces.

Wafer diameter

Features

DFS8910

φ

8”

Fully-automatic workpiece

handling, processing, and cleaning

DFS8960

φ

300/200 mm

DAS8920

φ

8”

Simple and compact semi-

automatic model

DAS8930

φ

300 mm

Before planarization

After planarization

DFS8960

DAS8920