Engineering Product Specification

DRAQ75-150-R

Revision C

TITLE: Shielded Drum Inductor 15uH @ 1.2A (peak), SMT, 4 Pads

Eaton Confidential

1 Specification

1.1 Electrical parameters

Parallel Connections (1,2 - 3,4)

Test item

Test pin

Test condition

Spec

OCL

1,2 – 3,4

@0.25Vrms, 100KHz

15.14 uH ± 25%

OCL

1,2 – 3,4

@0.25 Vrms, 100kHz & 2.36 ADC

9.08 uH min

Turns Ratio

(1 - 3):(2 – 4)

@0.25 Vrms, 100kHz

1:1(±5%)

DCR

(1 – 3)

@ 25ºC

160.0mΩ max

DCR

(2 – 4)

@ 25ºC

160.0mΩ max

Hi-Pot

1 to pin 4

500Vdc 1.0 mA, 1 sec

500Vdc

Irms

1,2 – 3,4

For approximately 40ºC rise above ambient

2.80 A Typ

1,2 – 3,4

@ 0.25V, 100KHz

2.36 A Typ

1,2 – 3,4

@ 0.25V, 100KHz

1.89 A Typ

Tem. Range

@ Irms

-40°C ~ 165°C

K Factor

1,2 – 3,4

67.5

1.

2.

3.

Measure Hi-pot from winding to winding

4.

currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components

will affect the temperature rise. It is recommended that the temperature of the part not exceed 165 °C under

worst case operating conditions verified in the end application.

5.

6.

7.

K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10

from table), L: (inductance in nH), I (peak-to-peak ripple current in amps)

8.

Storage Temperature: -40 °C to +165 °C

9.

Operating Temperature: -40 °C to +165 °C (ambient + self-temperature rise)

10. Resistance to soldering heat: 260±5 °C for 10 ~ 11 seconds