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HMC521ALC4TR-R5 データシート(PDF) 24 Page - Analog Devices |
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HMC521ALC4TR-R5 データシート(HTML) 24 Page - Analog Devices |
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24 / 24 page ![]() HMC521ALC4 Data Sheet Rev. 0 | Page 24 of 24 OUTLINE DIMENSIONS 12 0.50 BSC 2.50 REF BOTTOM VIEW TOP VIEW 1 24 7 13 18 19 6 0.36 0.30 0.24 EXPOSED PAD PIN 1 INDICATOR 4.05 3.90 SQ 3.75 3.10 BSC FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 2.60 2.50 SQ 2.40 PIN 1 0.32 BSC 0.08 BSC SIDE VIEW 1.00 0.90 0.80 SEATING PLANE Figure 88. 24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range MSL Rating2 Package Description Package Option HMC521ALC4 −40°C to +85°C MSL3 24-Terminal Ceramic Leadless Chip Carrier [LCC] E-24-1 HMC521ALC4TR −40°C to +85°C MSL3 24-Terminal Ceramic Leadless Chip Carrier [LCC] E-24-1 HMC521ALC4TR-R5 −40°C to +85°C MSL3 24-Terminal Ceramic Leadless Chip Carrier [LCC] E-24-1 EV1HMC521ALC4 Evaluation PCB Assembly 1 All models are RoHS compliant. 2 See the Absolute Maximum Ratings section, Table 2. ©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D16780-0-7/18(0) |
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