PRECAUTION FOR USE

SOLDERING

Flat Package (SMD Package)

Elements mounting styles of electronic devices are gaining in further diversification over recent

years, and needs for components are all the more expanding in varieties. Especially, surface mounting

is steadily penetrating into industrial segments as a world-wide popular technical trend.

Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering

temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability.

(a) When employing solder reflow method

Atmospheric temperature around resin surfaces must be less than 240 , not exceeding the time length of 10 sec.

Recommend temperature profile

Precautions on heating method

When resin in kept exposed to high temperature for a long time, device reliability may be marred.

Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising.

(b) When employing halogen lamps or infrared-ray heaters

When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause

extensive localized temperature rise.

Please keep a reflow solder operating when SMD package’s soldering.

60 sec.

Time (sec.)

Within 30 sec.

Within 10 sec.

Fig. 6

150

210

240

2012. 05. 02

5/5

FA431Z/ZS/ZF

Revision No : 4