RECOMMENDED LAND PATTERN

Dimension Limits

Units

C

Contact Pad Width (X4)

Contact Pad Spacing

Contact Pad Width (X2)

Contact Pitch

X2

X1

0.25

0.65

MILLIMETERS

0.825 BSC

MIN

E

MAX

1.45

Space Between Contacts (X3)

Space Between Contacts (X4)

G2

G1

0.60

0.38

Microchip Technology Drawing C04-3005A

NOM

6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]

1

2

6

Y

Contact Pad Length (X6)

0.85

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

C

E

X1

X2

Y

G1

G2

SILK SCREEN

DSA1101/21/05/25

DS20005890B-page 14

 2018 Microchip Technology Inc.