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RF-RU0402TS-BC-B1 データシート(PDF) 16 Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

部品番号 RF-RU0402TS-BC-B1
部品情報  The Colour LED which was fabricated using a red chipPackage Dimension
PDF  21 Pages
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メーカー  REFOND [SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.]
ホームページ  http://www.refond.com/
Logo REFOND - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

RF-RU0402TS-BC-B1 データシート(HTML) 16 Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

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Tel: +86-755-66839118
Fax:+86-755-66839300
E-mail:sales@refond.com
Web: www.refond.com
PAGE:16
REFOND:WI-E-045
A/3
REV:E/0
TG-201906251338NP
Notes
(1)Reflow soldering should not be done more than twice. If more than 24 hours between the two solderings ,
LED will be damaged.
(2)When soldering , do not put stress on the LEDs during heating.
3.1.1 Soldering Iron
(1) When do soldering by hand, keep the temperature of iron below less 300℃ less than 3
seconds.
(2) Soldering by hand should be done only one time.
3.1.2 Repairing
Repairing should not be done after the LEDs have been soldered. When repairing is
unavoidable,a double-head soldering iron should be used (as below figure). It should be
confirmed in advance whether the characteristics of LEDs will or not be damaged by repairing.
LED
3.1.3 Cautions
(1) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering,
do not warp the circuit board.LED
(2) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering. Do not rapidly cool device after soldering.



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