TMPA1003S-R82MN-D datasheet(1/3 Pages) TAI-TECH

部品番号	TMPA1003S-R82MN-D

部品情報	SMD Power Inductor

PDF	3 Pages

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メーカー	TAI-TECH [TAI-TECH Advanced Electronics Co., Ltd.]

ホームページ	https://www.tai-tech.com.tw/en/

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1 / 3 page

TAI-TECH

leadframe

non-leadframe

1. Features

2. Applications

3. Dimensions

A

C

D

2R2

1932

A

C

D

R22

1932

4. Part Numbering

TMPA1003S-Series(N)-D

1. Shielded construction.

2. Capable of corresponding high frequency.

3. Low loss realized with low DCR.

4. High performance (Isat) realized by metal dust core.

5. Ultra low buzz noise, due to composite construction.

6. 100% Lead(Pb)-Free and RoHS compliant.

7. Operating temperature -40~+125℃(Including self - temperature rise)

1. DC/DC converters in distributed power systems.

2. DC/DC converter for Field Programmable Gate Array(FPGA).

3. Battery powered devices.

4. Thin type on-board power supply module for exchanger.

5. VRM for server.

6. High current, low profile POL converters.

7. PDA/notebook/desktop/server and battery powered devices.

TMPA

1003

S

-

R22

MN

-

D

A

B

C

D

E

F

A: Series

B: Dimension

BxC.

C: Type

Standard.

D: Inductance

R22=0.22uH.

E: Inductance Tolerance

M=±20%.

F: Code

Marking: Black.R22 and 1932(19 YY, 32WW,follow production date).

SMD Power Inductor

Recommend PC Board Pattern

L

G

L(mm)

G(mm)

H(mm)

13.6

5.4

3.5

Note: 1. The above PCB layout reference only.

2. Recommend solder paste thickness at

0.15mm and above.

Series

A

B

C

D

E

TMPA1003

11.0±0.5 10.0±0.3 2.8±0.2

2.0±0.3

See Spec

table

Unit:mm

Halogen-free

Halogen

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