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STM32MP151F データシート(PDF) 246 Page - STMicroelectronics |
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STM32MP151F データシート(HTML) 246 Page - STMicroelectronics |
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246 / 253 page  Package information STM32MP151C/F 246/253 DS12501 Rev 3 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 75. LFBGA448 marking (package top view) 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Stencil opening 0.320 mm Stencil thickness 0.125 mm to 0.100 mm Table 121. LFBGA - Recommended PCB design rules (0.8 mm pitch, BGA) (continued) Dimension Recommended values MSv60333V1 Y WW Product identification STM32MP15xxAAx R Revision |
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