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MPXM12GS データシート(PDF) 6 Page - NXP Semiconductors

部品番号 MPXM12GS
部品情報  10 kPa Uncompensated Silicon Pressure Sensors
PDF  20 Pages
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メーカー  NXP [NXP Semiconductors]
ホームページ  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPXM12GS データシート(HTML) 6 Page - NXP Semiconductors

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MPX12
Sensors
6
Freescale Semiconductor
Pressure
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential/gauge die. A gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
Operating characteristics, internal reliability and
qualification tests are based on use of dry clean air as the
pressure media. Media other than dry clean air may have
adverse effects on sensor performance and long term
reliability. Contact the factory for information regarding media
compatibility in your application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing gel which isolates
the die from the environment. Freescale’s MPx12 series is
designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table
Gel Die Coat
Wire Bond
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Differential Sensing
Element
P2
Lead Frame
Part Number
Case Type
Pressure (P1) Side
Identifier
MPX12D
344
Stainless Steel Cap
MPX12DP
344C
Side with Part Marking
MPX12GP
344B
Side with Port Attached
MPXV12DP
1351
Side with Part Marking
MPXV12GP
1369
Side with Port
MPXV12GW6U
1735
Side with Port
MPXV12GW7U
1560
Side with Port
MPXM12GS/GST1
1320A
Side with Port Attached



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