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LM3224 データシート(PDF) 12 Page - National Semiconductor (TI) |
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LM3224 データシート(HTML) 12 Page - National Semiconductor (TI) |
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12 / 18 page ![]() Operation (Continued) where R O is the output impedance of the error amplifier, approximately 900k Ω. Since R C is generally much less than R O, it does not have much effect on the above equation and can be neglected until a value is chosen to set the zero f ZC. f ZC is created to cancel out the pole created by the output capacitor, f P1. The output capacitor pole will shift with differ- ent load currents as shown by the equation, so setting the zero is not exact. Determine the range of f P1 over the ex- pected loads and then set the zero f ZC to a point approxi- mately in the middle. The frequency of this zero is deter- mined by: Now R C can be chosen with the selected value for CC. Check to make sure that the pole f PC is still in the 10Hz to 500Hz range, change each value slightly if needed to ensure both component values are in the recommended range. HIGH OUTPUT CAPACITOR ESR COMPENSATION When using an output capacitor with a high ESR value, or just to improve the overall phase margin of the control loop, another pole may be introduced to cancel the zero created by the ESR. This is accomplished by adding another capaci- tor, C C2, directly from the compensation pin VC to ground, in parallel with the series combination of R C and CC. The pole should be placed at the same frequency as f Z1, the ESR zero. The equation for this pole follows: To ensure this equation is valid, and that C C2 can be used without negatively impacting the effects of R C and CC,fPC2 must be greater than 10f ZC. CHECKING THE DESIGN With all the poles and zeros calculated the crossover fre- quency can be checked as described in the section DC Gain and Open-loop Gain. The compensation values can be changed a little more to optimize performance if desired. This is best done in the lab on a bench, checking the load step response with different values until the ringing and overshoot on the output voltage at the edge of the load steps is minimal. This should produce a stable, high performance circuit. For improved transient response, higher values of R C should be chosen. This will improve the overall bandwidth which makes the regulator respond more quickly to tran- sients. If more detail is required, or the most optimum per- formance is desired, refer to a more in depth discussion of compensating current mode DC/DC switching regulators. POWER DISSIPATION The output power of the LM3224 is limited by its maximum power dissipation. The maximum power dissipation is deter- mined by the formula P D =(Tjmax -TA)/ θ JA where T jmax is the maximum specidfied junction temperature (125˚C), T A is the ambient temperature, and θ JA is the ther- mal resistance of the package. LAYOUT CONSIDERATIONS The input bypass capacitor C IN, as shown in the typical operating circuit, must be placed close to the IC. This will reduce copper trace resistance which effects input voltage ripple of the IC. For additional input voltage filtering, a 100nF bypass capacitor can be placed in parallel with C IN, close to the V IN pin, to shunt any high frequency noise to ground. The output capacitor, C OUT, should also be placed close to the IC. Any copper trace connections for the C OUT capacitor can increase the series resistance, which directly effects output voltage ripple. The feedback network, resistors R FB1 and R FB2, should be kept close to the FB pin, and away from the inductor, to minimize copper trace connections that can in- ject noise into the system. Trace connections made to the inductor and schottky diode should be minimized to reduce power dissipation and increase overall efficiency. For more detail on switching power supply layout considerations see Application Note AN-1149: Layout Guidelines for Switching Power Supplies. www.national.com 12 |
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