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LM393LV-Q1

SNOSDB3 – JUNE 2020

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information, LM393LV

LM393LV-Q1

UNIT

D

(SOIC)

PW

(TSSOP)

8 pin

8 pin

Junction-to-ambient thermal resistance

167.7

221.7

°C/W

Junction-to-case (top) thermal resistance

107.0

109.1

°C/W

Junction-to-board thermal resistance

111.2

152.5

°C/W

Junction-to-top characterization parameter

53.1

36.4

°C/W

Junction-to-board characterization parameter

110.4

150.7

°C/W

Junction-to-case (bottom) thermal resistance

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°C/W