MB1F-S datasheet(1/3 Pages) LEIDITECH

部品番号	MB1F-S

部品情報	Surface mount bridge rectifiers

PDF	3 Pages

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メーカー	LEIDITECH [Shanghai Leiditech Electronic Technology Co., Ltd]

ホームページ	http://www.leiditech.com

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1 / 3 page

MB05F-S thru MB10F-S

Surface mount bridge rectifiers

Features

●

Glass passivated die construction

●

Low forward voltage drop

●

High surge current capability

●

Desgned for surface mount application

●

Component in accordance to

RoHS 2011/65/EU

Major Ratings and Characteristics

Mechanical Date

●

Case:MBF-S

Molding compound meets

UL 94 V-0 flammability rating

●

Terminals: Solder plated, solderable per

MIL-STD-750， Method 2026

●

Polarity: Polarity symbols marked on body

●

Marking: type number

Maximum Ratings & Thermal Characteristics (T

A = 25 °C unless otherwise noted)

Note：1.On glass epoxy P.C.B. mounted on 0.05x0.05" (1.3mmx1.3mm) pads

2.On aluminum substrate P.C.B. with mounted on 0.05×0.05"(1.3×1.3mm) solder pad

IF(AV)

0.5A,0.8A

VRRM

50V to 1000V

IFSM

30A

Items

Maximum repetitive peak reverse voltage

Maximum RMS reverse voltage

Maximum DC blocking voltage

Maximum average forward rectified current

at TA(see Fig1.)

-on glass-epoxy P.C.B

(1)

-on aluminum substrate

(2)

IF(AV)

0.8

Peak forward surge current 8.3ms single

half sine-wave superimposed on rated load

Thermal resistance from junction to ambient

0.5

30

85

TJ,TSTG

20

-55 to +150

RθJL

(1)

140

280

420

600

V

560

°C/W

℃

Symbol

MB

10F-S

V

800

50

100

200

400

600

VRRM

MB

05F-S

MB

1F-S

A

400

A

700

800

1000

1.0V

5.0μA

V

Tjmax.

150℃

1000

Unit

MB

2F-S

MB

4F-S

MB

6F-S

MB

8F-S

50

IR

VF

RθJA

(1)

100

35

70

200

VRMS

VDC

IFSM

Thermal resistance from junction to lead

Operating junction and storage temperature

range

MBF-S

Rev : 01.06.2014

1/3

www.leiditech.com

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