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AF3002 データシート(PDF) 6 Page - 3M Electronics

部品番号 AF3002
部品情報  3M Scotch-WeldTM Core SpliceAdhesive Film
PDF  7 Pages
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メーカー  3M [3M Electronics]
ホームページ  http://www.3m.com
Logo 3M - 3M Electronics

AF3002 データシート(HTML) 6 Page - 3M Electronics

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Scotch-WeldTM
Core Splice Adhesive Film
AF 3002
- 6 -
Product Application
(continued)
B. Aluminum Honeycomb Core
1. Soak in clean aliphatic naphtha* (to conform to TT-N-95A) for five minutes
at room temperature. Dry 10 minutes at 150°F ± 10°F (66°C ± 5°C).
2. Optional – Immerse in etching solutions for two (2) minutes at 50°F ± 5°F
(10°C ± 2°C). Rinse, air dry and force dry in similar manner to skin panels.
*Note: When using solvents, extinguish all ignition sources and follow the
manufacturer’s precautions and directions for use.
II. Film:
Care should be taken to avoid contaminating adhesive and cleaned or primed
aluminum by any substance which will hinder wetting action of the adhesive.
Film Application:
1. Cut portion of film to be used from roll with protective liners in place.
2. Remove liner from one side of film.
3. Place film on metal or edge of honeycomb core using the remaining liner as a
protective cover.
4. On metal surfaces, roll film into position with a rubber roller to insure that no air
is trapped between the film and metal.
5. Remove second protective liner.
6. Assemble parts and cure. Tack if necessary at 120-180°F (49-82°C).
III. Cure Cycle:
A. General
The tack, flow, expansion, and cure initiation temperature for 3M™ Scotch-
Weld Core Splice Adhesive Film AF 3002 is a time-temperature relationship
and depends upon the rate of heat input.
Normally, Scotch-Weld AF 3002 will have the following properties:
Tack Temperature:
120-180°F (49-82°C)
Flow Temperature:
180-250°F (82-121°C)
Cure Initiation Temperature:
250°F (121°C)
For a 50 mil layer of Scotch-Weld AF 3002, a minimum cure temperature of
250°F (121°C), is suggested to affect a useful cure in a reasonable length of
time (approximately 60 minutes).
B. Cure Cycle (Autoclave or Platen Press) for a 50 mil layer of Scotch-Weld
AF 3002.
The following cure cycle is suggested to obtain bond lines which give the
strengths reported in the Test Results section.
Cure Cycle: 50 psi, 10°F/min., 60 min. @ 250°F (121°C) or below. Cool to
200°F (93°C) or below before removing pressure.



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