6.4 Thermal Information

THERMAL METRIC(1)

SN74HCS86

UNIT

PW (TSSOP)

D (SOIC)

BQA (WQFN)

14 PINS

14 PINS

14 PINS

Junction-to-ambient thermal resistance

151.7

133.6

109.7

°C/W

79.4

89.0

111.0

°C/W

Junction-to-board thermal resistance

94.7

89.5

77.9

°C/W

Junction-to-top characterization

parameter

25.2

45.5

20.2

°C/W

Junction-to-board characterization

parameter

94.1

89.1

77.8

°C/W

Junction-to-case (bottom) thermal

resistance

N/A

N/A

56.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Positive switching threshold

2 V

0.7

1.5

V

4.5 V

1.7

3.15

6 V

2.1

4.2

Negative switching threshold

2 V

0.3

1.0

V

4.5 V

0.9

2.2

6 V

1.2

3.0

2 V

0.2

1.0

V

4.5 V

0.4

1.4

6 V

0.6

1.6

High-level output voltage

2 V to 6 V

V

4.5 V

4.0

4.3

6 V

5.4

5.75

Low-level output voltage

2 V to 6 V

0.002

0.1

V

4.5 V

0.18

0.30

6 V

0.22

0.33

Input leakage current

6 V

±100

±1000

nA

Supply current

6 V

0.1

2

µA

Input capacitance

2 V to 6 V

5

pF

Power dissipation capacitance

per gate

No load

2 V to 6 V

10

pF

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SN74HCS86

SCLS783B – JANUARY 2020 – REVISED JANUARY 2021

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