3

Table 3. Thermal Properties

Parameter

Test Conditions

Value

Thermal Resistance,

qjc

Ambient operational temperature TA = 25°C

Channel-to-backside Thermal Resistance Tchannel(Tch)=34°C

Thermal Resistance at backside temperature Tb=25°C

qjc = 27 °C/W

Absolute Minimum and Maximum Ratings

Table 4. Minimum and Maximum Ratings

Description Pin

Min.

Max.

Unit

Comments

Drain to Ground Supply Voltage, Vd

5.5

V

Gate to Ground Voltage, Vg

+0.8

V

Drain Current , Id

100

mA

Gate Current, Ig

1

mA

RF CW Input Power, Pin

10

dBm

CW

Channel Temperature, Tch

+150

°C

Storage Temperature, Tstg

-65

+150

°C

Maximum Assembly Temperature, Tmax

260

°C

20 second maximum

Notes:

1. Operation in excess of any one of these conditions may result in permanent damage to this device.