MF-MSHT Series – PTC Resettable Fuses

Specificationsaresubjecttochangewithoutnotice.

Usersshouldverifyactualdeviceperformanceintheirspecificapplications.

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Solder Reflow Recommendations

TP

TP

tp

ts

T TO

RAMP-UP

L

TL

t L

25

Ts max

Ts min

PREHEAT

Time

CRITICAL ZONE

RAMP-DOWN

t 25 °C TO PEAK

Notes:

• MF-MSHT models are intended for reflow soldering

(including, but not limited to heating plate, hot air, IR,

nitrogen, and vapor phase).

• Wave soldering is permissible only if the device is on the top

of the PCB, opposite the heat source.

• Hand soldering is not recommended for these devices.

• All temperatures refer to the topside of the device, measured

on the device body surface.

• If reflow temperatures exceed the recommended profile,

devices may not meet the published specifications.

• Compatible with Pb and Pb-free solder reflow profiles.

• Excess solder may cause a short circuit.

• Please refer to the Multifuse® Polymer PTC Resettable Fuse

Soldering Recommendations document for more details.

Profile Feature

Pb-Free Assembly

3 °C / second max.

PREHEAT:

150 °C

200 °C

60~180 seconds

TIME MAINTAINED ABOVE:

217 °C

60~150 seconds

260 °C

20~40 seconds

Ramp-Down Rate

6 °C / second max.

Time 25 °C to Peak Temperature

8 minutes max.