CF5034 series

NIPPON PRECISION CIRCUITS INC.—2

PAD LAYOUT

(Unit: µm)

PAD DESCRIPTION AND DIMENSIONS

BLOCK DIAGRAM

Chip size: 1.16

× 1.31mm

Chip thickness: 300 ± 30µm

Chip base: GND potential

Pad No.

Name

I/O

Function

Pad dimensions [µm]

XY

1

VCC

–

Supply pin

146

145

2

XIN

I

Oscillator input pin

536

145

3

XOUT

O

Oscillator output pin

809

145

4

GND

–

Ground pin

1015

145

5OE

I

Output enable pin. Outputs are high impedance when LOW (oscillator

stopped). Power-saving pull-up resistor built-in.

979

1165

6

TEST

I

IC test pin. Leave open circuit for normal operation.

839

1165

7

VCC2

–

Output buffer supply pin

690

1165

8

OUTN

O

Output pin (complementary)

449

1165

9

OUT

O

Output pin (true)

216

1165

OUTN

(0,0)

(1160,1310)

X

Y

12

3

4

98

7

6

5

OUT

VCC2

TEST

OE

VCC

XIN XOUT GND

XIN

VCC

OE

XOUT

1/2

OUT

VCC2

GND

OUTN

ECL