ADMV1012

Data Sheet

Rev. A | Page 4 of 19

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

VDLO

4 V

VGRF

0 V

6 V

Input Power

RF

15 dBm

LO

15 dBm

Maximum Junction Temperature

175°C

Maximum Power Dissipation

2 W

>1 million hours

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering 60 sec)

260°C

Moisture Sensitivity Level (MSL) Rating

MSL3

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

750 V

Field Induced Charged Device Model

(FICDM)

500 V

by this difference. If a maximum VDRF voltage of +4 V is required, then the

minimum VGRF voltage is −2 V.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

thermal resistance, junction to case (°C/W).

Table 3. Thermal Resistance

Package Type

Unit

E-32-1

33.4

34

°C/W

thermal impedance (PCB with 3 × 3 vias).

ESD CAUTION