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MCP48FVB08 データシート(PDF) 96 Page - Microchip Technology |
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MCP48FVB08 データシート(HTML) 96 Page - Microchip Technology |
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96 / 112 page  MCP48FXBX4/8 DS20006362A-page 96 2020 Microchip Technology Inc. RECOMMENDED LAND PATTERN Microchip Technology Drawing C04-2139B (MQ) 20-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x1.0 mm Body [VQFN] SILK SCREEN 1 2 20 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Dimension Limits Units C1 Optional Center Pad Width Contact Pad Spacing Contact Pad Spacing Optional Center Pad Length Contact Pitch C2 T2 W2 3.35 3.35 MILLIMETERS 0.65 BSC MIN E MAX 4.50 4.50 Contact Pad Length (X20) Contact Pad Width (X20) Y1 X1 0.55 0.40 G Distance Between Pads 0.20 NOM With 0.40 mm Contact Length C1 C2 EV EV E X2 Y2 ØV G Y1 X1 |
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