 |
データシートサーチシステム |
|
|
データシートサーチシステム |
|
EDSTRG44PLCC データシート(PDF) 53 Page - Texas Instruments |
|
|
|||||||||||||||||||||||||||||
EDSTRG44PLCC データシート(HTML) 53 Page - Texas Instruments |
|
|
53 / 78 page  RELIABILITY STRESS TESTS 2–7 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 Table 2. Definitions of Microprocessor Testing Terms (Continued) TERM DEFINITION/DESCRIPTION REFERENCES Thermal Shock Test similar to the temperature cycle test, but involving a liquid-to-liquid transfer. MIL-STD-883C, Method 1011 Particle Impact Noise Detection (PIND) A nondestructive test to detect loose particles inside a device cavity. Mechanical Sequence Fine and gross leak Mechanical shock PIND (optional) Vibration, variable frequency Constant acceleration Fine and gross leak Electrical test MIL-STD-883C, Method 1014 MIL-STD-883C, Method 2002, 1500 g, 0.5 ms, Condition B MIL-STD-883C, Method 2020 MIL-STD-883C, Method 2007, 20g, Condition A MIL-STD-883C, Method 2001 MIL-STD-883C, Method 1014 To data sheet limits Thermal Sequence Fine and gross leak Solder heat (optional) Temperature cycle (10 cycles minimum) Thermal shock (10 cycles minimum) Moisture resistance Fine and gross leak Electrical test MIL-STD-883C, Method 1014 MIL-STD-750C, Method 1014 MIL-STD-883C, Method 1010, – 65 to + 150 °C, Condition C MIL-STD-883C, Method 1011, – 55 to +125 °C, Condition B MIL-STD-883C, Method 1004 MIL-STD-883C, Method 1014 To data sheet limits Thermal/Mechanical Sequence Fine and gross leak Temperature cycle (10 cycles minimum) Constant acceleration Fine and gross leak Electrical test Electrostatic discharge Solderability Solder heat Salt atmosphere Lead pull Lead integrity Electromigration Resistance to solvents MIL-STD-883C, Method 1014 MIL-STD-883C, Method 1010, – 65 to +150 °C, Condition C MIL-STD-883C, Method 2001, 30 kg, Y1 Plane MIL-STD-883C, Method 1014 To data sheet limits MIL-STD-883C, Method 3015 MIL-STD-883C, Method 2033 MIL-STD-750C, Method 2031, 10 sec MIL-STD-883C, Method 1009, Condition A, 24 hrs min MIL-STD-883C, Method 2004, Condition A MIL-STD-883C, Method 2004, Condition B1 Accelerated stress testing of con- ductor patterns to ensure accept- able lifetime of power-on operation MIL-STD-883C, Method 2015 Texas Instruments reserves the right to make changes in semiconductor test limits, procedures, or processes without notice. Unless prior arrangements for notification have been make, TI advises all customers to verify current test and manufacturing conditions prior to relying on published data. |
|
リンク URL |
| ALLDATASHEETはお客様のビジネスに役立ちますか？ [ DONATE ] |
Alldatasheetは | 広告 | お問い合わせ | プライバシーポリシー | データシートへのリンク | リンク交換 | メーカーリスト All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Japanese ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
