TAI-SAW TECHNOLOGY CO., LTD.

7

TST DCC

Release document

F. RECOMMENDED REFLOW PROFILE :

Products can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC

J-STD-020C, the temperature profile suggested is as follow:

Phase

Profile features

Pb-Free Assembly

(SnAgCu)

PREHEAT

-Temperature Min(Tsmin)

-Temperature Max(Tsmax)

-Time(ts) form (Tsmin to Tsmax)

150℃

200℃

60-120 seconds

RAMP-UP

Avg. Ramp-up Rate (Tsmax to TP)

3℃/second(max)

REFLOW

-Temperature(TL)

-Total Time above TL (t L)

217℃

30-100 seconds

PEAK

-Temperature(TP)

-Time(tp)

260℃

3 second

RAMP-DOWN

Rate

6℃ / second max.

Time from 25℃ to Peak Temperature

8 minutes max.

Composition of solder paste

96.5Sn/3Ag/0.5Cu

Solder Paste Model

SHENMAO PF606-P26

All the temperature measure point is on top surface of the component, if temperature over recommend,

it will make component surface peeling or damage.