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Dimensions

 

Chip Size

0603

L

1.6mm +/-0.15mm

W

0.8mm +/-0.15mm

T

0.8mm +/-0.07mm

S

0.7mm MIN

B

0.35mm +/-0.15mm

Packaging Specifications

 

Packaging

T&R, 180mm, Paper Tape

Packaging Quantity

4000

General Information

 

Series

SMD Comm X8R HT150C

Style

SMD Chip

Description

SMD, MLCC, High Temperature, Ultra-Stable

Features

High Temperature, Ultra-Stable

RoHS

Yes

Termination

Tin

Marking

No

AEC-Q200

No

Component Weight

4800 ug

Shelf Life

78 Weeks

MSL

1

Specifications

 

Capacitance

330 pF

Measurement Condition

1 MHz 1.0Vrms

Capacitance Tolerance

20%

Voltage DC

50 VDC

Dielectric Withstanding Voltage

125 VDC

Temperature Range

-55/+150°C

Temperature Coefficient

X8R

Capacitance Change with Reference

to +25°C and 0 VDC Applied (TCC)

15%, 1MegaHz 1.0Vrms

Dissipation Factor

2.5% 1 MHz 1.0Vrms

Aging Rate

0% Loss/Decade Hour:

Referee Time is 1000 Hours

Insulation Resistance

100 GOhms

C0603C331M5HACTU

SMD Comm X8R HT150C, Ceramic, 330 pF, 20%, 50 VDC, X8R, SMD, MLCC,

High Temperature, Ultra-Stable, 0603

Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and we specifically disclaim - any

warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the

correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no

obligation or liability for the advice given or results obtained.

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