11.

Revision History

Revision C (March 2021)

Corrected SOIC Package Type drawing. Updated the SOIC package drawing.

Revision B (December 2020)

Updated Revision History to latest template. Removed thin height WLCSP product offering. Replaced terminology

“Master” and “Slave” with “Host” and “Client”, respectively.

Revision A (May 2019)

“Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in

package markings. Updated section content throughout for clarification. Updated SOIC package drawing to Microchip

format.

Atmel Document 8828 Revision E (January 2017)

Updated Power-on Requirements and Reset Behavior section.

Atmel Document 8828 Revision D (May 2016)

Added the 8U-18 standard thickness WLCSP package option. Updated the “Clock and Data Transition

Requirements” section and the “DC Characteristics” table.

Atmel Document 8828 Revision C (November 2015)

Corrected 8-ball WLCSP pinout.

Atmel Document 8828 Revision B (August 2015)

Updated the 8U-11 package drawing, data retention discrepancy and 8-ball pinout.

Atmel Document 8828 Revision A (May 2015)

Initial document release.

AT24CM02

Revision History

Datasheet

DS20006197C-page 29