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MSCSM170TAM23CTPAG データシート(PDF) 12 Page - Microchip Technology |
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MSCSM170TAM23CTPAG データシート(HTML) 12 Page - Microchip Technology |
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12 / 17 page ![]() 2. Package Specifications The following section shows the package specification of the MSCSM170TAM23CTPAG device. 2.1 Package Outline The following figure shows the package outline drawing of the MSCSM170TAM23CTPAG device. The dimensions in the following figure are in millimeters. Figure 2-1. Package Outline Drawing Note: See AN1902—Mounting Instruction for SP6–P (12 mm) Power Modules for more information. MSCSM170TAM23CTPAG Package Specifications © 2021 Microchip Technology Inc. Datasheet DS00003965A-page 12 |
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